We have advised Olympus Partners-backed Engineered Foam Products (EFP), a designer and manufacturer of returnable packaging and component solutions for many of the world’s biggest industries, on raising acquisition finance to support the acquisition of Cordek, a leading provider of specialist technical solutions.
The transaction represents a significant milestone in EFP's growth strategy and further strengthens its position as one of the UK's leading engineered foam and expanded polystyrene businesses.
With over 50 years of heritage, EFP designs and manufactures highly engineered foam solutions serving a diverse range of end markets, including infrastructure, industrial, packaging, HVAC, automotive and the built environment. The business has established a market-leading position through its national manufacturing footprint, long-standing customer relationships and highly specification-led product offering.
Cordek is a highly complementary acquisition that broadens EFP's technical and engineering capabilities and adds an established portfolio of proprietary brands. The acquisition expands the group's geographic reach, provides access to complementary customers and product categories, and further strengthens its ability to provide innovative, specification-led solutions across a broader range of specialist applications.
The combined business will benefit from increased scale, an expanded branded product portfolio, greater engineering capability and a broader presence across attractive, resilient end markets. Together, EFP and Cordek will form a stronger and more diversified platform, well positioned to build on EFP's existing market leadership and pursue further growth in the UK and internationally.
More about the process
Our Debt Advisory team delivered a bespoke financing process that reflected the full value of the combined business. The resulting debt package captured the enlarged group's enhanced earnings, cash generation and balance sheet strength, supporting both the acquisition and EFP's next phase of growth.